GIỚI THIỆU VỀ TẬP NÀY
The High Density Packaging User Group recently released its Annual Progress Report. In this episode, Marketing Director Madan Jagernauth discusses the group's R&D activities over the past year, as well as the challenges facing designers and manufacturers working with today's extreme densities and the organization's future plans. He also shares a preview of several sessions that the group will present at PCB West 2026.
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