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Photonic Integrated Circuits are powering the next wave of AI and data‑center innovation, but packaging and standards are becoming major challenges to scale. In this episode, we sit down with Peter O’Brien, Richard Pitwon, and Kazu Takano to break down the real‑world obstacles behind PIC adoption. …
Wireless is only the last hop. In this episode of LightMinds, Ruqayyah Kechiche (Chair, BICSI UK & Ireland) and Dr. Bernard Lee (Vice Chair) explain why structured cabling and standards are the foundation behind Wi‑Fi, cloud, and AI data centers. A clear, practical conversation on the physical …

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Welcome to LightMinds, a podcast about the technologies shaping the future of connectivity, delivered through smart, curious, and approachable conversations.From silicon photonics and fiber optics to optical networking, data centers, and what’s coming next, LightMinds explores how light is powering…
Active Alignment plays a key role in enabling modern optical packaging and silicon photonics.In this episode of LightMinds, Arturo Santiago sits down with Justin Bressi, Chris Heisler, and Ryan Vallance to discuss how active alignment works, the challenges it presents, and where the technology is h…
Zastrzeżenie: Podcast i grafika osadzone na tej stronie pochodzą z Senko Advanced Components, który jest własnością jego właściciela i nie jest powiązany ani wspierany przez Listen Notes, Inc.