Transforming Compute Possibilities with Multi-Die Systems

As AI agents grow more capable, the question of trust becomes increasingly critical, especially in complex engineering environments like semiconductor and PCB design. Siemens EDA and NVIDIA are tackling that challenge head-on, combining deep EDA domain expertise with cutting-edge AI infrastructure …

Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven, challenges in bandwidth, latency, power, and interoperability intensify. In this episode, we unpac…

In this episode of EE Times Current, we’ll dive into Physical AI — from humanoids and embodied agents to the chips, sensors, and systems that let machines see, move, and interact with us. Guiding us through this future of silicon is our host, Hezi Saar, Executive Director of Product Marketing at Sy…

In this latest episode of Brains and Machines, Dr. Patty Stabile of the Eindhoven University of Technology chats with us about  her optical neural networks with ultra-low-latency processing, and the semiconductor optical amplifiers that make them possible. Discussion follows with Dr. Giulia D’Angel…