이 에피소드에 관해
Today, we are focusing on a key challenge in modern power design: delivering higher efficiency, reduced EMI, and advanced thermal management while minimizing size and complexity. Our speaker is Anton Winkler, a systems engineer and power modules technologist at Texas Instruments, who drives the development of new processes and technologies for power modules. During this podcast, we will discuss TI’s MagPack technology, which integrates magnetic packaging to deliver good power density, reduced EMI and improved thermal performance.
영어
미국
전사 🔗
Are you the producer of this podcast?
Add a podcast transcript
Need Audio-to-Text?
Transcribe with Listen411 in Just 60 Seconds
이 팟캐스트의 다른 에피소드
Diamond is emerging as a game-changer in power electronics and quantum technology thanks to its exceptional properties like high thermal conductivity, breakdown voltage and drift velocity. In this episode, Adam Khan, CEO of Diamond Quanta, discusses the company's innovative co-doping approach that …
The demand for greater efficiency, density, and reliability in power delivery is driving semiconductor innovation as artificial intelligence reshapes data centers. Renesas Electronics is leveraging its expertise and expanding GaN portfolio to adapt to these changes. In this podcast, Pietro Scalia, …
Welcome to today’s podcast, where we explore the dynamic world of Industrial MCUs with Marijana Vukicevic, Marketing Director for Industrial MCU at Infineon.
Today’s episode is brought to you by our sponsor, Infineon.
Today, it’s a pleasure to have a special guest, Marijana Vukicevic, joining us to…
In today’s episode of PowerUp, we’re joined by Donald Wright, VP of engineering at Unico, a provider of advanced testing solutions for EV propulsion systems. With extensive experience in EV battery development, testing, and certification, Wright shares insights into the evolving landscape of the EV…
면책 조항: 이 페이지에 포함된 팟캐스트와 작품은 AspenCore에서 가져온 것입니다. 이 팟캐스트는 소유자의 재산이며 Listen Notes, Inc.와 제휴하거나 보증하지 않습니다.