SELLEST OSAST
This is part two of a two-part series.
In Part One, we explored how the electronics industry transitioned from a clean-everything approach to one where cleaning became optional. But what happens when the assumptions behind “no-clean” collide with modern electronics design?
In this episode of Reliability Matters, Mike Konrad examines how the definition of cleanliness has fundamentally changed.
As assemblies became smaller, denser, and increasingly deployed into harsh environments, the industry discovered that historical cleanliness standards were no longer sufficient to predict real-world reliability. Modern low stand-off components like QFNs, BGAs, and CSPs create tight geometries where residues can become trapped and difficult to remove, while thermal cycling and internal condensation can create localized harsh environments inside the product itself.
This episode explores:
• Why IPC moved away from fixed cleanliness limits
• The growing importance of SIR and ROSE testing
• Why “cleanliness” is now tied to risk, not a number
• How internal condensation can trigger electrochemical migration
• Why no-clean flux has become the most commonly cleaned flux type in the industry
• The return of cleaning as a mainstream reliability process
• Why modern assemblies require aggressive spray-in-air cleaning technologies instead of historical immersion-based vapor degreasing methods
• How diffused spray patterns improve cleaning beneath low stand-off components
Konrad also explains how modern cleaning challenges are no longer just about chemistry. They are about physics, fluid delivery, and whether the cleaning process can physically reach contamination hidden beneath today’s densely packed components.
As electronics continue to shrink and reliability expectations continue to rise, one question becomes increasingly important: Clean enough for what?
If you work in electronics manufacturing, reliability engineering, process engineering, or quality assurance, this episode provides a detailed look at why post-reflow cleaning has once again become a critical part of modern electronics manufacturing.
In Part One, we explored how the electronics industry transitioned from a clean-everything approach to one where cleaning became optional. But what happens when the assumptions behind “no-clean” collide with modern electronics design?
In this episode of Reliability Matters, Mike Konrad examines how the definition of cleanliness has fundamentally changed.
As assemblies became smaller, denser, and increasingly deployed into harsh environments, the industry discovered that historical cleanliness standards were no longer sufficient to predict real-world reliability. Modern low stand-off components like QFNs, BGAs, and CSPs create tight geometries where residues can become trapped and difficult to remove, while thermal cycling and internal condensation can create localized harsh environments inside the product itself.
This episode explores:
• Why IPC moved away from fixed cleanliness limits
• The growing importance of SIR and ROSE testing
• Why “cleanliness” is now tied to risk, not a number
• How internal condensation can trigger electrochemical migration
• Why no-clean flux has become the most commonly cleaned flux type in the industry
• The return of cleaning as a mainstream reliability process
• Why modern assemblies require aggressive spray-in-air cleaning technologies instead of historical immersion-based vapor degreasing methods
• How diffused spray patterns improve cleaning beneath low stand-off components
Konrad also explains how modern cleaning challenges are no longer just about chemistry. They are about physics, fluid delivery, and whether the cleaning process can physically reach contamination hidden beneath today’s densely packed components.
As electronics continue to shrink and reliability expectations continue to rise, one question becomes increasingly important: Clean enough for what?
If you work in electronics manufacturing, reliability engineering, process engineering, or quality assurance, this episode provides a detailed look at why post-reflow cleaning has once again become a critical part of modern electronics manufacturing.
Inglise
Ameerika Ühendriigid
TRANSKRIBEERI 🔗
Are you the producer of this podcast?
Add a podcast transcript
Need Audio-to-Text?
Transcribe with Listen411 in Just 60 Seconds
OTSI VARASEMAID OSASID
Otsi kanali PCB Chat viimaseid osasid.
MUUD EPISOOD SELLES PODCASTIS
For decades, cleaning circuit assemblies after soldering was not optional. It was standard practice across the electronics manufacturing industry. Then, almost overnight, that changed.
In this episode of Reliability Matters, Mike Konrad takes you back to the origins of that shift. From the widespr…
What if passing the test is not enough?
In reliability engineering, we often place a great deal of confidence in laboratory validation. We test, measure, analyze, and document. And when the product passes, we naturally assume it is ready for the field.
But what happens when a product passes the l…
Tomachie has quite a few tricks up its sleeve. Its eponymous platform provides AI-assisted analysis of PCB schematic data. It optimizes DfT and identifies the ideal locations for physical test point insertion. And it generates a 0-100 layout-readiness score, providing design teams with an objective…
Today, we’re going to explore a topic that seems to be touching nearly every industry, every workplace, and increasingly every part of our daily lives: artificial intelligence.
But this conversation is not just about what AI can do. It’s about what AI assumes, what it values, what it misses, and w…
Vastutamatussäte: Sellele lehele manustatud taskuhäälingusaade ja kunstiteosed pärinevad PCEA-lt, mis on selle omaniku omand ja ei ole seotud ettevõttega Listen Notes, Inc.
MUUDA
Aitäh, et aitad hoida podcastide andmebaasi ajakohasena.
