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Today, we are focusing on a key challenge in modern power design: delivering higher efficiency, reduced EMI, and advanced thermal management while minimizing size and complexity. Our speaker is Anton Winkler, a systems engineer and power modules technologist at Texas Instruments, who drives the development of new processes and technologies for power modules. During this podcast, we will discuss TI’s MagPack technology, which integrates magnetic packaging to deliver good power density, reduced EMI and improved thermal performance.
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Today’s episode is brought to you by our sponsor, Infineon.
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إخلاء المسؤولية: البودكاست والأعمال الفنية المضمنة في هذه الصفحة مأخوذة من AspenCore، وهي مملوكة لمالكها وليست تابعة لشركة Listen Notes, Inc أو معتمدة منها.
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