معلومات عن هذه الحلقة

الإنجليزية
الولايات المتحدة

النص 🔗

البحث في الحلقات الماضية

البحث في الحلقات السابقة من Inside Electronics.

حلقات أخرى في هذا البودكاست

Designed to break the economic and operational payload-to-weight barriers in vertical lift aviation, the high-stakes competition challenged teams to design lightweight aircraft capable of lifting up to four times their unladen weight. Smith and Marin share how they took the program from executive a…
Currently, AI and edge computing are hitting a wall when it comes to power budgets, latency, and cloud dependence, hindering real-world deployments. This issue is complicated by the need to integrate a great deal of input from sensors and other devices. In this episode, we talk to Sumeet Kumar, co-…
Simulations abound in designing everything from aircraft to chiplet-based system-on-chips (SoC). It is too expensive to live by trial-and-error but simulations can require lots of time and hardware to let the software return the final evaluation. In this episode of Inside Electronics, co-host Bill …
In this special episode of Electronic Design’s Inside Electronics, sponsored by DigiKey and Qorvo, Guest Host David Maliniak of Microwaves & RF, speaks with Qorvo General Manager Debbie Gibson and Principal Product Manager Suma Kapilavai about RF design for drones. Debbie Gibson emphasizes tha…
إخلاء المسؤولية: البودكاست والأعمال الفنية المضمنة في هذه الصفحة مأخوذة من Endeavor Business Media، وهي مملوكة لمالكها وليست تابعة لشركة Listen Notes, Inc أو معتمدة منها.